Custom-made Ceramic
and Glass Components
Shapal?Hi-M soft Analysis
Comparison of Shapal™-M soft with Shapal™ Hi-M soft and traditional ceramics
This information is provided to help existing users of Shapal™-M soft compare it with the new Shapal™ Hi-M soft material and also to help users of traditional ceramics evaluate this machinable ceramic for their application.
Comparison of flexural strengths and thermal conductivities (Typical Data)
Data Supplied by Tokuyama Corporation, Tokyo, Japan
Impurities
Element | Shapal™-M soft | Shapal™ Hi-M soft |
C | 300ppm | 300ppm |
Ca | 450ppm | 1300ppm |
Cr | 60ppm | 1ppm |
Mg | 15ppm | 1ppm |
Ni | <5ppm | 2ppm |
Fe | 20ppm | 8ppm |
Si | <15ppm | 40ppm |
O | 0.5% | 0.9% |
Ti | <1 | <20 |
Property/Test Conditions | Shapal™-M soft | Shapal™ Hi-M soft | Units |
GENERAL | |||
Density Corrected to 4°C | 2.88 | 2.88 | g/cm³ |
Porosity 25°C | 0 | 0 | % |
ELECTRICAL | |||
Volume Resistivity 25°C, DC | 1.4 x 1012 | 1.0 x 1015 | Ωcm |
Dissipation Factor (tan δ) 25°C, 1MHz | 9.1 x 10-4 | 10 x 10-4 | |
Dielectric Constant (ε) 25°C, 1MHz | 6.9 | 6.8 | |
Dielectric Strength |
56 | 65 | kV/mm |
THERMAL | |||
Thermal Expansion Coefficient RT~400°C | 4.4 x 10-6 | 4.8 x 10-6 | /°C |
Thermal Expansion Coefficient RT~600°C | 4.8 x 10-6 | 4.9 x 10-6 | /°C |
Thermal Expansion Coefficient RT~800°C | 5.1 x 10-6 | 5.0 x 10-6 | /°C |
Thermal Conductivity 25°C | 96 | 92 | W/mK |
Maximum Use Temp. (in air) | 1,000 | 1,000 | °C |
Maximum Use Temp (in nonoxidizing atmosphere) | 1,900 | 1,900 | °C |
Thermal Shock Resistance ∆t water quench | 400 | 400 | °C |
MECHANICAL | |||
Bending Strength 25°C | 273 | 300 | MPa |
Compressive Strength 25°C | 120 | 100 | kg/mm2 |
Young's Modulus 25°C | 1.9 x 104 | 1.8 x 104 | kg/mm2 |
Poisson's Ratio 25°C | 0.31 | 0.31 | |
Vickers Hardness (Hv) 25°C, 300g | 390 | 380 | kg/mm2 |
CHEMICAL DURABILITY | |||
Resistance to Acid 10%HCI 24Hrs, 25°C | 0.2 | 0.2 | mg/cm2 wt loss |
Resistance to Base 10%NaOH 24Hrs, 25°C | 60 | 60 | mg/cm2 wt loss |
Note: Shapal™ is a registered trademark of Tokuyama Corporation, Tokyo, Japan